1. The ultra-thin copper foil main specifications is from 2μm to 5μm.
2. Product species: NPU, NPUE,CL series, with a very low surface roughness, easy tear-off and excellent etching resistance (L / S 30/30).
3. Product species :CL series, applied to coreless process.
Applied to IC board, Coreless process and other use of the material for the printed circuit board (PCB) manufacturing, including IC board, Coreless substrates.
Product Index A~Z
Ultra Thin Copper Foil